Résumé
:
Mise à jour
prochaine
Domaine d'activité :
Mise à jour
prochaine
Publications
:
Brevets :
Y. Leduc, N. Messina, C. Duvvury & K.P. Wachtler,
“In package esd protections of IC using a thin film polymer”, Brevet
TI, United States Patent Application 20080278873, 17 Mars 2008.
Y. Leduc, N. Messina, K.J. Taylor, L.N. Hutter, J.O.
Smith, B.L. Williams, A.R. Singh, S.R. Summerflet & D.L. Callahan,
“Circuit logic embedded within IC protective layer”, Brevet TI, United
States Patent Application 20090020313, 22 January 2009.
Revues internationales :
Y. Vaiarello, W. Tatinian, Y. Leduc, N. Veau & G.
Jacquemod, “Ultra-Low-Power Audio Communication System for Cochlear
Implant Application”, Journal of Low Power Electronics, vol.
8, n°5, pp. 706-716, 2012.
Y. Vaiarello, W.
Tatinian, Y. Leduc, N. Veau & G. Jacquemod, “Ultra low power radio
microphone for cochlear implant application”, IEEE Journal of
Emerging and Selected Topics in Circuits And Systems, vol. 1,
n°4, pp. 622-630, 2011.
Communications
invitées :
G. Jacquemod, Y.
Vaiarello, Y. Leduc & C. Luxey,
“Low power wireless microphone transceiver based on analog to time
conversion for cochlear implant application”, IEEE Singapore
Section Microwave Theory and Techniques/Antennas and Propagation,
ECE NUS, Singapore, 2013.
G. Jacquemod, D. Jausseran, O. Diop, Y. Vaiarello, A.
El Amraoui, F. Ferrero, W. Tatinian, A. Diallo, Y. Leduc, N. Veau, C.
Laporte, H. Ezzeddine & C. Luxey,
“Low power wireless microphone transceiver based on analog to time
conversion for cochlear implant application”, ICSS,, Orlando,
USA, pp. 74-82, 2012.
Y. Vaiarello, Y. Leduc,
N. Veau & G. Jacquemod,
“Process variation compensation for wireless microphone applications”,
VARI, Sophia Antipolis, France, 2012.
Y. Leduc,
“Solutions pour éliminer les derniers éléments
passifs autour des SoCs”, FETCH, Alpe d'Huez, France, 2012.
Y. Leduc & G.
Jacquemod,
“Comparison How to take profit of 3D IC integration?”, D43D,
Grenoble, France, 2011.
Y. Leduc & G. Jacquemod,
“Projet DAIKON : Microcontrôleur multicoeur réalisé
en technologie asynchrone”, FETCH, Montréal, Canada,
2011.
Y. Leduc,
“La 3eme dimension peut-elle être le futur des systèmes
embarqués ?”, FETCH, Chamonix, France, 2010.
Y. Leduc,
“Power and Energy Management”, ECOFAC, Chexbres, 2010.
Y. Leduc,
“Les spécifications exécutables, une réponse
à la complexité de la conception des
systèmes hétérogènes”, FETCH,
Chexbres, 2009.
Conférences
internationales :
U. Cerasani, Y.
Vaiarello, Y. Leduc & G. Jacquemod,
“Matlab/Simulink modeling of RF microphone for cochlear implant
application”, SAME, Sophia Antipolis, France, 2011.
Y. Vaiarello, Y. Leduc, N. Veau & G. Jacquemod,
“Low power RF ADC based on voltage to time conversion”, SAME,
Sophia Antipolis, France, 2011. Best Demo Award
Y. Vaiarello, W.
Tatinian, Y. Leduc, N. Veau & G. Jacquemod,
“Ultra low power transmitter for cochlear implant application”,
CAS-FEST, Rio de Janeiro, Brazil, 2011.