Yves Leduc

Professeur associé
Chaire Industrielle TI

Polytech'Nice Sophia
1645, route des Lucioles
06410 Biot
France

Mail : Yves.Leduc(at)unice.fr
Autre : LinkedIn


Résumé :

Mise à jour prochaine


Domaine d'activité :

Mise à jour prochaine


Publications :

Brevets :

Y. Leduc, N. Messina, C. Duvvury & K.P. Wachtler, “In package esd protections of IC using a thin film polymer”, Brevet TI, United States Patent Application 20080278873, 17 Mars 2008.

Y. Leduc, N. Messina, K.J. Taylor, L.N. Hutter, J.O. Smith, B.L. Williams, A.R. Singh, S.R. Summerflet & D.L. Callahan, “Circuit logic embedded within IC protective layer”, Brevet TI, United States Patent Application 20090020313, 22 January 2009.

Revues internationales :

Y. Vaiarello, W. Tatinian, Y. Leduc, N. Veau & G. Jacquemod, “Ultra-Low-Power Audio Communication System for Cochlear Implant Application”, Journal of Low Power Electronics, vol. 8, n°5, pp. 706-716, 2012.

Y. Vaiarello, W. Tatinian, Y. Leduc, N. Veau & G. Jacquemod, “Ultra low power radio microphone for cochlear implant application”, IEEE Journal of Emerging and Selected Topics in Circuits And Systems, vol. 1, n°4, pp. 622-630, 2011.

Communications invitées :

G. Jacquemod, Y. Vaiarello, Y. Leduc & C. Luxey, “Low power wireless microphone transceiver based on analog to time conversion for cochlear implant application”, IEEE Singapore Section Microwave Theory and Techniques/Antennas and Propagation, ECE NUS, Singapore, 2013.

G. Jacquemod, D. Jausseran, O. Diop, Y. Vaiarello, A. El Amraoui, F. Ferrero, W. Tatinian, A. Diallo, Y. Leduc, N. Veau, C. Laporte, H. Ezzeddine & C. Luxey, “Low power wireless microphone transceiver based on analog to time conversion for cochlear implant application”, ICSS,, Orlando, USA, pp. 74-82, 2012.

Y. Vaiarello, Y. Leduc, N. Veau & G. Jacquemod, “Process variation compensation for wireless microphone applications”, VARI, Sophia Antipolis, France, 2012.

Y. Leduc, “Solutions pour éliminer les derniers éléments passifs autour des SoCs”, FETCH, Alpe d'Huez, France, 2012.

Y. Leduc & G. Jacquemod, “Comparison How to take profit of 3D IC integration?”, D43D, Grenoble, France, 2011.

Y. Leduc & G. Jacquemod, “Projet DAIKON : Microcontrôleur multicoeur réalisé en technologie asynchrone”, FETCH, Montréal, Canada, 2011.

Y. Leduc, “La 3eme dimension peut-elle être le futur des systèmes embarqués ?”, FETCH, Chamonix, France, 2010.

Y. Leduc, “Power and Energy Management”, ECOFAC, Chexbres, 2010.

Y. Leduc, “Les spécifications exécutables, une réponse à la complexité de la conception des systèmes hétérogènes”, FETCH, Chexbres, 2009.

Conférences internationales :

U. Cerasani, Y. Vaiarello, Y. Leduc & G. Jacquemod, “Matlab/Simulink modeling of RF microphone for cochlear implant application”, SAME, Sophia Antipolis, France, 2011.

Y. Vaiarello, Y. Leduc, N. Veau & G. Jacquemod, “Low power RF ADC based on voltage to time conversion”, SAME, Sophia Antipolis, France, 2011. Best Demo Award

Y. Vaiarello, W. Tatinian, Y. Leduc, N. Veau & G. Jacquemod, “Ultra low power transmitter for cochlear implant application”, CAS-FEST, Rio de Janeiro, Brazil, 2011.

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